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Early code runs demonstrated insufficient liquid return to the
evaporator section, and the eventual dry-out of the evaporator section
did not agree with experimental observations. One of the methods
which was employed to counteract this problem was variation of the
evaporation and condensation accommodation coefficients, but this
alone was insufficient (##hall88b ##hall88b, ##hall90a ##hall90a).
Further research into two areas yielded important information
that made a significant impact on the modeling effort
(##hall94 ##hall94). First, research into experimental accommodation
coefficient determination suggested that values closer to unity
were appropriate for heat pipe conditions (##nikn81 ##nikn81). Second,
research into the possibility of liquid tension, or negative liquid
pressure, produced several references which validated its physical
existence via experimentation. Liquid tension was originally
mentioned in ##bert50 (##bert50), and later multiple references are
given in ##hayw70 (##hayw70) and ##apfe72 (##apfe72). Also, negative liquid
pressure in heat pipes is treated specifically in ##kemm68 (##kemm68)
and ##ande93a (##ande93a), and experiments using Alkali Metal Thermal to
Electric Converter (AMTEC) cells are presented in ##ande92 (##ande92)
and ##citeasnoun (##citeasnoun)*ande93b. Subsequent to this research, changes were
made to the capillary pressure relationship in THROHPUT to allow
negative liquid pressure.
The original THROHPUT code was developed with only one working
fluid (lithium), one wall material (molybdenum) and one noncondensible
gas (air). Adding new materials involves locating and incorporating
functional forms for thermal conductivity, specific heat, density,
enthalpy, internal energy, viscosity, molecular weight and critical
point variables. With later modifications, the THROHPUT code
can now model several working fluids (lithium, sodium, potassium,
rubidium, cesium, mercury and silver), two wall materials (molybdenum
and rhenium) and one noncondensible gas (air).
Next: Results
Up: THE THROHPUT CODE
Previous: Surface Model
Michael L. Hall