Laser Detection Of Material Thickness

There is provided a method for measuring material thickness.

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Laser Detection Of Material Thickness

There is provided a method for measuring material thickness comprising: (a) contacting a surface of a material to be measured with a high intensity short duration laser pulse at a light wavelength which heats the area of contact with the material, thereby creating an acoustical pulse within the material: (b) timing the intervals between deflections in the contacted surface caused by the reverberation of acoustical pulses between the contacted surface and the opposite surface of the material: and (c) determining the thickness of the material by calculating the proportion of the thickness of the material to the measured time intervals between deflections of the contacted surface.

U.S. Patent No.: 6,445,547 (DOE S-91,762)

Patent Application Filing Date: August 23, 1999

Patent Issue Date: September 3, 2002

Licensing Status:

Available for Express Licensing(?). View terms and a sample license agreement.

For more information, contact Licensing@lanl.gov.


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